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Compact Socket Adapter System Now Available for 0.50mm pitch BGA and LGA Device Validation
Advanced Interconnections Corp. recently introduced a 0.50mm pitch BGA Socket Adapter System. A breakthrough in fine pitch socket technology, this new hybrid design utilizes both male and female pins in an interstitial pattern - offering the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the device package, with no external hold-downs required, this patent pending design is perfect for development and validation of BGA and LGA devices, while offering superior electrical performance with very low signal attenuation up to 2.5GHz. Features and benefits include: • Small overall size and same footprint as device - only 2.00mm larger than device • Designed for development and validation of BGA and LGA devices, production level socketing, and SMT board to board connector applications • Standard eutectic Tin/Lead solder balls or new lead-free Tin/Silver/Copper solder ball terminals for RoHS Compliant applications • Unique alignment pins protect pin field and aid in hand placement with optional stand-offs available
ARIES REVOLUTIONARY PINBALL™ SOCKET NOW AVAILABLE FOR 0.50 MM TO 0.80 MM PITCH PACKAGES
Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has expanded the range of its side-stackable PinBall™ socket to include pitch packages from 0.50 mm through 0.80 mm. The device is ideal for applications using BGA, LGA, CSP and other devices on 0.50 mm or larger pitch.
The space saving sockets can be soldered side-by-side, directly to the existing footprint of a PC board. Clearances range from 0.5 mm to 2.0 mm depending on the pitch. The socket bolt tabs take up minimal space to allow for maximum component space around the socket.
The PinBall Socket incorporates Aries’ reliable spring probe technology, with a spring probe contact force of 12 g to 15 g per contact. The interposer on the top of the socket features two chip guides that help align the device with the spring probes and provide a positive lid compression stop to accurately control the spring probe deflection.
Users have the choice of either an aluminum cover or a standard or customized aluminum heatsink. The lid slides on and off easily with a few quick turns of the included nut driver tool. The socket is available in two hold-down styles: two-bolt for 15 mm or smaller packages or four-bolt for 16 mm to 50 mm packages.
The new socket features 63/37 tin-lead solderballs on the PCB mating side and a male spring probe on the device mating side. The body is constructed of standard FR-4 material. The spring probe pins are beryllium copper alloy with 30 µ" minimum gold over 30 µ" minimum nickel and the hardware is stainless steel.
ARIES - NEW 12-BALL MICROBGA TO 14-PIN DIP ADAPTER NOW AVAILABLE FROM ARIES
Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has announced a new adapter that enables designers to test or bread board a 12-ball microBGA device on an existing PCB with 0.300" holes. The top of the adapter accepts a 12-ball microBGA on 0.5 mm pitch; the bottom of the adapter features 14 DIP pins.
The UL 94V-0-rated adapter body is constructed of a 0.062" thick glass-filled FR-406 material with one ounce copper traces and ENIG (electroless nickel immersion gold) plating. Male pins are brass alloy 360 with 200 µ" tin/lead over 100 µ" nickel per QQ-N-290.
The new Aries adapter is part of the company’s unique Correct-A-ChipTM line of intelligent connectors that can modify existing designs without changing existing PCB layouts. The adapter can be furnished in custom materials, platings, sizes and configurations to meet specific application needs.
